华虹NEC盛装参展SEMICON China 2011

2012-08-28 11:11:45 来源:半导体器件应用网

摘要:  此次会议为业内人士搭建了合作、交流、共赢的平台,公司将继续巩固在特色代工领域的领先地位,开拓创新、不断超越,与业界同仁携手共创中国集成电路产业更加辉煌的明天!

关键字:  晶圆,  博览中心,  工业,  信息化,  IC


(中国,上海—2011年3月24日)年度盛会SEMICON China 2011于2011年3月15日至17日在新国际博览中心成功举行,世界领先的纯晶圆代工厂之一,上海华虹NEC电子有限公司(“华虹NEC”)携其特色工艺平台及其最新研发成果盛装参展。

3月15日上午,工业信息化部副部长刘利华和上海市经济和信息委员会领导莅临华虹NEC展台参观指导。上海华虹(集团)有限公司总裁顾晓春、华虹NEC副总裁孙瑞坤分别就华虹NEC取得的最新成果向刘部长一行作了介绍,刘部长对华虹NEC近年来取得的成绩表示了充分的肯定,并鼓励公司要继续抓住新兴市场机遇,在特色代工领域做大做强。

华虹NEC总裁兼CEO邱慈云博士受邀在开幕主题演讲上做了题为“把握战略性新兴产业发展机遇,再创中国集成电路辉煌明天”的精彩演讲。他表示,国家大力倡导低碳经济、绿色经济,积极推进七大战略性新兴产业的发展,将给集成电路产业带来巨大的发展机遇。华虹NEC销售与市场副总裁高峰在同期举办的“中国IC设计与制造之路”专题研讨会上发表了题为“打造世界一流的功率器件工艺平台”的演讲,重点介绍了华虹NEC在模拟/电源管理及分立器件领域取得的突出成就,表示华虹NEC将不断增强自主创新能力,为客户提供业界领先的功率器件工艺平台与优质服务。

此次会议为业内人士搭建了合作、交流、共赢的平台,公司将继续巩固在特色代工领域的领先地位,开拓创新、不断超越,与业界同仁携手共创中国集成电路产业更加辉煌的明天!

关于华虹NEC:

上海华虹NEC电子有限公司成立于1997年7月,是中国大陆第一家8英寸晶圆厂,现已成为世界领先的专业集成电路晶圆代工企业。客户遍及中国大陆、中国台湾、韩国、日本以及美国等国家与地区。公司目前拥有两条8英寸生产线,月产能接近9万片。公司总部位于中国上海,在台湾、日本、北美和欧洲等地均提供销售与技术支持。

华虹NEC为国内外客户提供涵盖1.0~0.13微米工艺的、专业的、高附加值代工服务,专注于嵌入式非挥发性存储器、模拟/电源管理芯片、高压、射频以及功率器件等特色工艺平台以及逻辑、混合信号等通用工艺平台,代工产品已广泛应用于智能卡(第二代身份证卡、SIM卡、社保卡等)、通讯、计算机、消费类电子以及汽车电子等领域。

华虹NEC为其客户提供全方位、全天候服务,包括各类技术支持、单元库与IP、版图验证、晶圆加工、晶圆测试、可靠性测试和失效分析等。此外,华虹NEC还可以透过其合作伙伴向客户提供包括掩膜版制作和封装测试在内的一站式服务。

华虹NEC先后通过了ISO9001质量管理体系、ISO14001环境管理体系、ISO27001信息安全管理体系、OHSAS18001职业健康安全管理体系认证,获得美国商务部产业和安全局(“BIS”) 的“经验证最终用户”(“VEU”) 授权,并且通过了TS16949体系符合性审核。华虹NEC由此具有更高的产品品质和信息安全性。

Hua Hong NEC Participates in SEMICON China 2011
(Shanghai, China-----24th March, 2011) Semiconductor Annual Event “SEMICON China 2011” was successfully held at Shanghai New International Expo Center from March 15th to March 17th, 2011. Shanghai Hua Hong NEC Electronics Company, Ltd. (“Hua Hong NEC”), one of the leading pure-play foundries in the world, presented its advanced featured technologies and latest R&D achievements.

Mr. Liu Lihua, Deputy Minister of Industry and Information Technology, and other officials of Shanghai Municipal Commission of Economy and Informatization, visited Hua Hong NEC’s booth in the morning of 15th March. Mr. Gu Xiaochun, President of Shanghai Huahong (Group) Co., Ltd. and Mr. Sun Ruikun, VP of Hua Hong NEC, showed Mr. Liu Hua Hong NEC’s latest major R&D accomplishments, and Mr. Liu highly appraised Hua Hong NEC’s greatest achievements in recent years and encouraged our company seizing the opportunities of emerging market to strengthen the field of featured foundries.
Dr. Tzu-Yin Chiu, President and CEO of Hua Hong NEC, delivered a great opening keynote speech on “Emerging Strategic Opportunities for China’s Accelerating Semiconductor Industry”. He emphasized that Chinese government has been strongly advocating low carbon green economy, and the development of seven strategic emerging industries, which will bring enormous opportunities to IC industry. Moreover, the Road of China IC Design and Manufacturing Conference held in the same period of SEMICON, Mr. Gao Feng, VP of Sales & Marketing of Hua Hong NEC, gave a speech on “Leading-edged Solution Enables Advanced Power Device”. He mainly introduced Hua Hong NEC’s prominent achievements in the field of analog & power management and discrete device. He said, “Hua Hong NEC will continuously enhance the capability of independent innovation, and provide customers with industry-leading power device technology platform as well as high quality of service.”
This event created a platform for cooperation, communication and win-win situation among industry professionals. Hua Hong NEC will consolidate the leading position in the field of featured foundries, innovating and developing, together with industry colleagues to build a brilliant tomorrow in Chinese IC industry.

About Hua Hong NEC:
Founded in July 1997, Shanghai Hua Hong NEC Electronics Company Limited is the first 8 inch semiconductor manufacturer of Mainland China and has become one of the world's leading pure-play wafer foundries, providing value-added foundry services to worldwide customers. The Company has two 8-inch foundry production lines in Mainland China which are both in mass production with the total capacity around 90K wafers per month. Hua Hong NEC, with its headquarters located in Shanghai China, extends its sales and technical support to Taiwan, Japan, North America and Europe.
Based on its solid foundation in 1.0~0.13um processes, Hua Hong NEC’s featured process platforms include embedded NVM, analog/power management, HV, RF and discrete device as well as logic, mixed signal possesses for a wide range of applications such as smart card, communications, consumer electronics, computer and automotive electronics.
Hua Hong NEC provides first-class round-the-clock services, including design support, library/IP, mask layout, wafer processing, wafer sorting, reliability testing and failure analysis. Collaborating with its partners, Hua Hong NEC also provides one stop services including mask manufacturing, package and final testing.
To date, Hua Hong NEC has been awarded various international certifications such as ISO9001 for quality system, ISO14001 for environmental protection, ISO27001 for information security, OHSAS18001 for occupational health safety, VEU authorization from the U.S. Commerce Department's BIS, and the letter of conformance of TS16949 for quality management. Proven by such certifications, Hua Hong NEC ensures its customers of high product quality and information security.


工业和信息化部副部长刘利华亲临华虹NEC的展台参观.

Mr Liu Lihua, Deputy Minister of Industry and Information Technology, visited Hua Hong NEC’s booth.


 
华虹NEC总裁兼首席执行官邱慈云博士发表了题为“把握战略性新兴产业发展机遇,再创中国集成电路辉煌明天”的SEMICON 2011开幕演讲。

Dr. Tzu-Yin Chiu, President and CEO of Hua Hong NEC, delivered an opening Keynote speech on “Emerging Strategic Opportunities for China’s Accelerating Semiconductor Industry” at SEMICON 2011.


华虹NEC销售与市场副总裁高峰先生在中国IC设计与制造之路研讨会发表了题为“打造世界一流的功率器件工艺平台”的精彩演讲。

Mr. Gao Feng, VP of Sales & Marketing of Hua Hong NEC, gave a speech on “Leading-edged Solution Enables Advanced Power Device” at the Road of China IC Design and Manufacturing Conference.


华虹NEC新颖别致的展台吸引了众多参观者。

Hua Hong NEC's booth attracted and impressed many visitors.

 

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